Title :
Wireless Bonding for Maximizing Throughput in Multi-Radio Mesh Networks
Author :
Kim, Sung-Ho ; Ko, Young-Bae
Author_Institution :
Graduate Sch. of Inf. & Commun., Ajou Univ., Suwon
Abstract :
To enhance the per node throughput, mesh nodes in wireless mesh networks can be equipped with multiple network interfaces (NIC). In this paper, we propose a new multi-interface equipped architecture, named "wireless bonding (WBond)", which enables each node to fully utilize all its available interfaces, resulting in increased throughput. The proposed WBond provides a method for exposing a single virtual interface by bonding multiple NICs. When a node needs to transfer a packet, WBond selects one among the multiple interfaces depending upon the channel quality assigned to each interface. A novel method for measuring channel quality, called as "ChanQual", is presented and used by the WBond with high accuracy and no additional overhead. Comparison studies using ns-2 simulations show that our WBond scheme can achieve the most reliable and highest performance (i.e., network throughput) compared to traditional multi-interface architectures
Keywords :
radio networks; wireless channels; WBond scheme; channel quality; multiinterface equipped architecture; multiradio mesh networks; network interfaces; ns-2 simulations; throughput maximization; virtual interface; wireless bonding; Bonding; Educational institutions; Ethernet networks; IP networks; Mesh networks; Network interfaces; Spine; Telecommunication network reliability; Throughput; Wireless mesh networks;
Conference_Titel :
Pervasive Computing and Communications Workshops, 2007. PerCom Workshops '07. Fifth Annual IEEE International Conference on
Conference_Location :
White Plains, NY
Print_ISBN :
0-7695-2788-4
DOI :
10.1109/PERCOMW.2007.126