Copper metallization for advanced ULSI devices using spray electroless plating technology

This paper will describe some of the features and requirements necessary for the spray electroless Cu method such as seed layer, deposition rate and in-situ process controls. Provision for pre-plating and post-plating wafer clean, in-situ chamber cleaning and incorporation of novel electroless seed layers deposition will also be discussed. Finally data showing the feasibility of the spray electroless method, throughput, process performance and cost of ownership will be presented.