DocumentCode
2240665
Title
Copper CVD precursors and processes for advanced metallization
Author
Doppelt, P.
Author_Institution
Lab. de Chimie Inorg., CNRS, Paris, France
fYear
1997
fDate
16-19 March 1997
Firstpage
23
Lastpage
24
Abstract
Chemical research to identify the "ideal" precursor for copper CVD is still actively being pursued by our group and others. We give here our last results on the performances of new precursors. The major goal of this research is to provide a material which enables the reproducible manufacturing of thin-film copper circuitry with defect-free filling of vias, low electrical resistivity and long-term reliability. Furthermore, the critical understanding of the chemical and physical properties for these CVD precursors may enable precursors with vastly improved properties to be synthesized.
Keywords
chemical vapour deposition; copper; metallisation; Cu; copper CVD precursor; electrical resistivity; metallization; reliability; thin-film circuitry; via; Chemical reactors; Chemical vapor deposition; Copper; Design optimization; Equations; Inorganic materials; Integrated circuit interconnections; Integrated circuit metallization; Liquids; Termination of employment;
fLanguage
English
Publisher
ieee
Conference_Titel
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location
Villard de Lans, France
ISSN
1266-0167
Type
conf
DOI
10.1109/MAM.1997.621045
Filename
621045
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