• DocumentCode
    2240665
  • Title

    Copper CVD precursors and processes for advanced metallization

  • Author

    Doppelt, P.

  • Author_Institution
    Lab. de Chimie Inorg., CNRS, Paris, France
  • fYear
    1997
  • fDate
    16-19 March 1997
  • Firstpage
    23
  • Lastpage
    24
  • Abstract
    Chemical research to identify the "ideal" precursor for copper CVD is still actively being pursued by our group and others. We give here our last results on the performances of new precursors. The major goal of this research is to provide a material which enables the reproducible manufacturing of thin-film copper circuitry with defect-free filling of vias, low electrical resistivity and long-term reliability. Furthermore, the critical understanding of the chemical and physical properties for these CVD precursors may enable precursors with vastly improved properties to be synthesized.
  • Keywords
    chemical vapour deposition; copper; metallisation; Cu; copper CVD precursor; electrical resistivity; metallization; reliability; thin-film circuitry; via; Chemical reactors; Chemical vapor deposition; Copper; Design optimization; Equations; Inorganic materials; Integrated circuit interconnections; Integrated circuit metallization; Liquids; Termination of employment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
  • Conference_Location
    Villard de Lans, France
  • ISSN
    1266-0167
  • Type

    conf

  • DOI
    10.1109/MAM.1997.621045
  • Filename
    621045