DocumentCode :
2244742
Title :
Residual Layer Distribution on Embossing Process for Photonic Devices
Author :
Choi, Chul-Hyun ; Lee, Min Woo ; Sung, Jun-Ho ; Kim, Bo-Soon ; Lee, Seung-Gol ; O, Beom-Hoan
Author_Institution :
Sch. of Inf. & Commun. Eng., INHA Univ., Incheon
fYear :
2007
fDate :
26-31 Aug. 2007
Firstpage :
1
Lastpage :
2
Abstract :
We report on the behavior and effect of the residual layer left on the substrate after embossing process for the fabrication of photonic devices. The PDMS material was used as mold, and thermal and UV curable polymers was adapted for the fabrication of demultiplexer and optical power splitter, respectively.
Keywords :
demultiplexing equipment; embossing; integrated optics; optical beam splitters; optical fabrication; optical polymers; PDMS material; UV curable polymers; demultiplexer; embossing process; optical power splitter; photonic devices; residual layer distribution; thermal curable polymers; Costs; Embossing; Mass production; Microstructure; Optical device fabrication; Optical devices; Optical materials; Optical polymers; Optical waveguides; Resists;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics - Pacific Rim, 2007. CLEO/Pacific Rim 2007. Conference on
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-1173-3
Electronic_ISBN :
978-1-4244-1174-0
Type :
conf
DOI :
10.1109/CLEOPR.2007.4391422
Filename :
4391422
Link To Document :
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