DocumentCode
2245652
Title
Locating and checking of a BGA pin´s position using gray level
Author
Ruo, Chi-Wei ; Shih, Ching-Long
Author_Institution
Dept. of Electr. Eng., Nat. Taiwan Univ. of Sci. & Technol., Taipei, Taiwan
Volume
3
fYear
2003
fDate
14-19 Sept. 2003
Firstpage
3523
Abstract
A machine vision system for SMT-mounting machine applications is usually a two-stage algorithm. It first measures the centroid and rotation angle of the SMD, and then checks each pin´s area, position error, and grid coordinate location. In this paper, a set of complete procedures is proposed to locate and check the BGA image. During the locating procedures, we first calculate a threshold of the frame using an iterative threshold algorithm. If an object is found under this threshold, then the pin´s area is calculated by the local threshold by using a momentum algorithm. After that, whether this object is a pin or not is decided by its neighbors´ relative positions, the approximate rotation angle for finding the outer pins is calculated, and the centroid as well as the rotation angle of a BGA component is calculated by the rectangular least squares algorithm. The checking procedure also measures each pin´s area using the momentum algorithm, then it calculates the radius of the moving sum using each pin´s area, and finally measures the position error using a moving sum algorithm and judges each pin´s type by gray level. The new method uses the gray level statistic information to solve the empty pad´s problem and utilizes the symmetrical property of a circle to deal with the shape problem. Lastly, the CRC algorithm is used to check the correspondence between each pin and its pin type. This new method has a high accuracy and a low execution time. It can meet the crucial timing requirement of a high-speed SMT machine through experimental verification.
Keywords
angular measurement; ball grid arrays; computer vision; iterative methods; least squares approximations; position control; printed circuit manufacture; rotation measurement; surface mount technology; BGA image; BGA pin; SMD centroid measurement; SMD rotation angle measurement; SMT mounting machine; ball grid array pin location; cyclic redundancy check; empty pads problem; gray level statistic information; grid coordinate location; iterative threshold algorithm; machine vision system; momentum algorithm; moving sum algorithm; position error; rectangular least squares algorithm; surface mounting device; surface mounting technology; two stage algorithm; Area measurement; Coordinate measuring machines; Iterative algorithms; Least squares approximation; Machine vision; Pins; Position measurement; Rotation measurement; Shape; Statistics;
fLanguage
English
Publisher
ieee
Conference_Titel
Robotics and Automation, 2003. Proceedings. ICRA '03. IEEE International Conference on
ISSN
1050-4729
Print_ISBN
0-7803-7736-2
Type
conf
DOI
10.1109/ROBOT.2003.1242135
Filename
1242135
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