Title :
A 3-D low-cost packaging technology for ceramic substrates
Author_Institution :
Georg-Simon-Ohm Univ. of Appl. Sci., Nuernberg, Germany
Abstract :
A 3-D packaging technology for ceramic substrates is described. Based on metallisation, mounting and soldering techniques, known from PCB mass production, it closes the gap between conventional thick-film hybrids and LTCCs with respect to packaging density and price. Samples manufactured on a lab scale show the potential of this technology. The reliability investigations comprise of peel off and thermal cycling tests
Keywords :
adhesion; ceramic packaging; hybrid integrated circuits; integrated circuit packaging; metallisation; printed circuits; reflow soldering; substrates; surface mount technology; thick film circuits; 3D low-cost packaging technology; LTCCs; PCB mass production; RML; ceramic substrates; lab scale samples; metallisation adhesion; mounting techniques; packaging density; packaging price; peel off tests; reflow soldered multilayer technology; reliability tests; soldering techniques; thermal cycling tests; thick-film hybrids; three-dimensional ceramic packages; Ceramics; Costs; Drilling; Electronic packaging thermal management; Electronics packaging; Manufacturing; Metallization; Nonhomogeneous media; Plasma temperature; Soldering;
Conference_Titel :
Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
Conference_Location :
Jeju Island
Print_ISBN :
0-7803-7157-7
DOI :
10.1109/EMAP.2001.983967
