• DocumentCode
    2247367
  • Title

    Thermal buckling actuator for micro relays

  • Author

    Seki, Tomonori ; Sakata, Minoru ; Nakajima, Takuya ; Matsumoto, Mikio

  • Author_Institution
    Central Res. & Dev. Lab., OMRON Corp., Ibaraki, Japan
  • Volume
    2
  • fYear
    1997
  • fDate
    16-19 Jun 1997
  • Firstpage
    1153
  • Abstract
    An actuator for micromachined relays has been investigated. The actuator is fabricated by the sealed-cavity process, a micromachining technology. It has a thin Si clamped-clamped beam which is deformed by buckling due to thermal SiO2 built-in stress and thermal stress. The actuator size is 2.5 mm(L)×0.5 mm(W)×0.02 mm(T). 25-micron deflection at the center point and 2.0 gf force were obtained with 27 V/25 mA input power
  • Keywords
    buckling; microactuators; micromachining; semiconductor relays; thermal stresses; 0.02 mm; 0.5 mm; 2.5 mm; 25 mA; 27 V; Si; Si clamped-clamped beam; Si-SiO2; actuator size; deflection; micromachined relays; micromachining technology; sealed-cavity process; thermal SiO2 built-in stress; thermal buckling actuator; thermal stress; Actuators; Capacitive sensors; Costs; Equations; Micromachining; Microrelays; Power system relaying; Relays; Thermal expansion; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    0-7803-3829-4
  • Type

    conf

  • DOI
    10.1109/SENSOR.1997.635409
  • Filename
    635409
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2247367