Development of micromachined switches with increased reliability

Author

Hiltmann, Kai M. ; Schmidt, Bertram ; Sandmaier, Hermann ; Lang, Walter

Author_Institution

Hahn-Schickard-Soc., Inst. of Micro- and Informationtechnol., Villingen-Schwenningen, Germany

Volume

2

fYear

1997

fDate

16-19 Jun 1997

Firstpage

1157

Abstract

By micromachining of silicon and glass, an electrical switch with low-resistance metal contacts was made. The switch is aimed at applications as a binary pressure sensor and to replace conventional push-button switches. First measurements on switches yielded electrical lifetimes over 10⁵ cycles and contact resistance clearly below 1 Ω

Keywords

borosilicate glasses; contact resistance; elemental semiconductors; life testing; micromachining; micromechanical devices; pressure sensors; semiconductor device reliability; semiconductor device testing; semiconductor switches; silicon; 1 ohm; 10 mA; 100 V; Si; Si membrane switches; Si-B2O3-SiO2; Si-BSG; Si/BSG micromachined switches; anodic bonding; binary pressure sensor; contact resistance; electrical lifetimes; electrical switch; low-resistance metal contacts; microswitch; reliability; testing; Biomembranes; Bonding; Contact resistance; Glass; Sensor systems; Silicon; Solid state circuits; Surface morphology; Switches; Switching circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on

Conference_Location

Chicago, IL

Print_ISBN

0-7803-3829-4

Type

conf

DOI

10.1109/SENSOR.1997.635410

Filename

635410