Application of finite difference techniques for the thermal modelling of power electronic switching devices

Three dimensional simulation software has been developed which allows the thermal modelling of power electronic switching devices and their associated heat sinks using finite difference techniques. The software is user friendly and simple to use with the user only having to specify physical dimensions and positions to run the models. Future work may involve extending the technique to develop three dimensional models for IGBTs and the ability to simulate up to sixteen IGBTs on a single heat sink