Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board

Author

Baek, Seungyong ; Gun Kam, Dong ; Park, Bongcheol ; Kim, Joungho ; Byun, Jung-Gun ; Choi, Cheol-Seung

Author_Institution

Adv. Reactor Dev. Div., Korea Atomic Energy Res. Inst., South Korea

Volume

1

fYear

2002

fDate

19-23 Aug. 2002

Firstpage

200

Abstract

An edge placement of high-speed differential lines breaks the balance of differential pair, that results in reducing current of each line of the differential pair. The impedance of the lines is deviated from the desired value. Moreover it becomes a significant source of the radiated emission. In this paper, the authors present a variation of differential mode impedance and common mode impedance caused by the edge placement of microstrip differential pair with finite ground width. Also, they demonstrate the effect of the edge-placement of the differential pair on the increase of the radiated emission noise.

Keywords

electric impedance; electromagnetic interference; printed circuits; common mode impedance; differential mode impedance; edge placement; finite ground width; high-speed differential lines; microstrip differential pair; printed circuit board; radiated emission source; Circuit noise; Crosstalk; Degradation; Electromagnetic interference; Impedance; Integrated circuit interconnections; Microstrip; Noise generators; Power transmission lines; Printed circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on

Conference_Location

Minneapolis, MN, USA

Print_ISBN

0-7803-7264-6

Type

conf

DOI

10.1109/ISEMC.2002.1032474

Filename

1032474