DocumentCode
2248688
Title
Modeling of realistic on-chip power grid using the FDTD method
Author
Choi, Jinseong ; Wan, Lixi ; Swaminathan, Madhavan ; Beker, Ben ; Master, Raj
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
1
fYear
2002
fDate
19-23 Aug. 2002
Firstpage
238
Abstract
In this paper, a multi-layered on-chip power distribution network has been modeled using the finite difference time domain (FDTD) method. This simulation consists of 0.5 million passive elements, 40000 distributed current sources and multiple C4 vias. In this method, a branch capacitor has been used, which is different from latency insertion method (LIM). The use of the branch capacitor is important for simulating multi-layered power grids. The current in the branch capacitor is extracted from Kirchhoffs current law. This provides a good model of the branch capacitor and does not require companion models during simulation. The proposed model has been verified with SPICE through a simple example. The on-chip power grid simulation, the characteristics of noise propagation and the effectiveness of on-chip decoupling capacitors have been discussed. Also the importance of the nonlinearity in the computation of the power supply noise in on- chip power grid has been addressed through the peak noise analysis using linear current source and clock distribution network.
Keywords
SPICE; finite difference time-domain analysis; printed circuits; FDTD method; Kirchhoff current law; SPICE; branch capacitor; clock distribution network; distributed current sources; finite difference time domain method; linear current source; multi-layered power grids; multiple C4 vias; noise propagation; on-chip power grid modelling; passive elements; peak noise analysis; power supply noise; simulation; Capacitors; Computational modeling; Delay; Finite difference methods; Kirchhoff´s Law; Network-on-a-chip; Power grids; Power systems; SPICE; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on
Conference_Location
Minneapolis, MN, USA
Print_ISBN
0-7803-7264-6
Type
conf
DOI
10.1109/ISEMC.2002.1032481
Filename
1032481
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