EMI reduction techniques for InfiniBand multi-GHz interconnect

Author

Ye, Xiaoning ; Miller, Dennis ; Tripathi, Alok

Author_Institution

Enterprise Archit. LAB, Intel Corp., Hillsboro, OR, USA

Volume

1

fYear

2002

fDate

19-23 Aug. 2002

Firstpage

430

Abstract

EMI compliance is becoming more and more challenging as the date transmission rate gets higher and higher. This paper discusses EM issues for a multi-GHz high-speed interconnect-the InfiniBand Architecture. Potential EMI problems are identified and addressed. EMI reduction solutions with measurement data support are presented including a cost-effective inter-plane capacitance approach, which significantly reduces system EM by implementing a board layout change.

Keywords

cables (electric); capacitance; electric connectors; electromagnetic interference; interconnections; printed circuits; EMI compliance; EMI reduction techniques; InfiniBand Architecture; InfiniBand multi-GHz interconnect; PCB; board layout change; cable connector; date transmission rate; high-speed interconnect; inter-plane capacitance approach; multi-GHz high-speed interconnect; shielding; Assembly systems; Cable shielding; Capacitors; Connectors; Electromagnetic interference; Filtering; Frequency; Heat sinks; Noise reduction; Power harmonic filters;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on

Conference_Location

Minneapolis, MN, USA

Print_ISBN

0-7803-7264-6

Type

conf

DOI

10.1109/ISEMC.2002.1032517

Filename

1032517