DocumentCode :
2252836
Title :
Wafer-scale processing, assembly, and testing of tunneling infrared detectors
Author :
Grade, John ; Barzilai, Aaron ; Reynolds, J. Kurth ; Liu, Cheng-Hsien ; Partridge, Aaron ; Jerman, Hal ; Kenny, Tom
Author_Institution :
Stanford Univ., CA, USA
Volume :
2
fYear :
1997
fDate :
16-19 Jun 1997
Firstpage :
1241
Abstract :
The individual assembly of early tunneling sensors required time and skill which were incompatible with high volume production and which produced a very large variation in key device operating parameters. This paper describes the first successful fully wafer-scale production of tunneling sensors. The sensors produced in this process feature noise and sensitivity characteristics consistent with the best tunneling sensors developed so far and are appropriate for use as state-of-the-art uncooled infrared detectors
Keywords :
infrared detectors; microsensors; semiconductor device noise; tunnelling; wafer-scale integration; high volume production; noise characteristics; sensitivity characteristics; testing; tunneling infrared detectors; uncooled infrared detectors; wafer-scale processing; Assembly; Biomembranes; Fabrication; Infrared detectors; Sensor phenomena and characterization; Silicon; Testing; Transducers; Tunneling; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
Type :
conf
DOI :
10.1109/SENSOR.1997.635453
Filename :
635453
Link To Document :
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