Title :
Effect of underfill staging time on fillet depression
Author :
Cheong, YW ; Then, Edward ; Ng, Cheong Huat ; Lee, Giam Seng ; Diaz, M. ; De Guia, Gilbert ; Loke, Mun Leong
Author_Institution :
Intel Technology (M) Sdn Bhd
Keywords :
Bonding; Inspection; Materials testing; Microscopy; Packaging; Resins; Soldering; TV; Temperature; US Department of Energy;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-7301-4
DOI :
10.1109/IEMT.2002.1032731
