A novel low-loss wafer-level packaging of the RF-MEMS devices

Author

Yun-Kwon Park ; Heung-Woo Park ; Duck-Jung Lee ; Jung-Ho Park ; In-Sang Song ; Chung-Woo Kim ; Ci-Moo Song ; Yun-Hi Lee ; Chul-Ju Kim ; Byeong Kwon Ju

Author_Institution

Display & Nano Devices Lab., Korea Inst. of Sci. & Technol., Seoul, South Korea

fYear

2002

fDate

24-24 Jan. 2002

Firstpage

681

Lastpage

684

Abstract

In this work, the flip-chip method was used for packaging an RF-MEMS switch on a quartz substrate with low losses. 4-inch Pyrex glass was used as a package substrate and was airblast punched with 250 /spl mu/m diameter holes. A Cr/Au seed layer was deposited on it and the vias were filled by plating with gold. After forming molds on the holes with thick photoresist, bumps were plated on holes. The package substrate was bonded with a quartz substrate using B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within -0.05 dB. This structure can be used for wafer level packaging of both RF-MEMS and other MEMS devices.

Keywords

coplanar waveguides; flip-chip devices; losses; micromechanical devices; microwave switches; plastic packaging; 250 micron; 4 in; Au plating; B-stage epoxy; CPW line; Cr-Au; Cr/Au seed layer; Pyrex glass package substrate; RF-MEMS switch; SiO/sub 2/; airblast punching; bump plating; flip-chip method; low-loss wafer-level packaging; mold forming; network analyzer; quartz substrate; thick photoresist; via filling; Chromium; Glass; Gold; Packaging; Radiofrequency microelectromechanical systems; Resists; Switches; Testing; Wafer bonding; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on

Conference_Location

Las Vegas, NV, USA

ISSN

1084-6999

Print_ISBN

0-7803-7185-2

Type

conf

DOI

10.1109/MEMSYS.2002.984362

Filename

984362