DocumentCode
2260045
Title
Energy-efficient variable-flow liquid cooling in 3D stacked architectures
Author
Coskun, Ayse K. ; Atienza, David ; Rosing, Tajana Simunic ; Brunschwiler, Thomas ; Michel, Bruno
Author_Institution
Electr. & Comput. Eng. Dept., Boston Univ., Boston, MA, USA
fYear
2010
fDate
8-12 March 2010
Firstpage
111
Lastpage
116
Abstract
Liquid cooling has emerged as a promising solution for addressing the elevated temperatures in 3D stacked architectures. In this work, we first propose a framework for detailed thermal modeling of the microchannels embedded between the tiers of the 3D system. In multicore systems, workload varies at runtime, and the system is generally not fully utilized. Thus, it is not energy-efficient to adjust the coolant flow rate based on the worst-case conditions, as this would cause an excess in pump power. For energy-efficient cooling, we propose a novel controller to adjust the liquid flow rate to meet the desired temperature and to minimize pump energy consumption. Our technique also includes a job scheduler, which balances the temperature across the system to maximize cooling efficiency and to improve reliability. Our method guarantees operating below the target temperature while reducing the cooling energy by up to 30%, and the overall energy by up to 12% in comparison to using the highest coolant flow rate.
Keywords
cooling; integrated circuit modelling; three-dimensional integrated circuits; 3D stacked architectures; 3D system; coolant flow rate; cooling efficiency; cooling energy; energy-efficient variable-flow liquid cooling; job scheduler; liquid flow rate; microchannels; multicore systems; pump energy consumption; pump power; thermal modeling; Coolants; Energy consumption; Energy efficiency; Fluid flow; Liquid cooling; Microchannel; Multicore processing; Power system modeling; Temperature control; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2010
Conference_Location
Dresden
ISSN
1530-1591
Print_ISBN
978-1-4244-7054-9
Type
conf
DOI
10.1109/DATE.2010.5457228
Filename
5457228
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