Indirect investigation of heat transfer of electronic system

Author

Frivaldsky, Michal ; Spanik, P. ; Drgona, P. ; Koscelnik, Juraj

Author_Institution

Dept. of Mechatron. & Electron., Univ. of Zilina, Zilina, Slovakia

fYear

2014

fDate

9-10 Sept. 2014

Firstpage

93

Lastpage

98

Abstract

This paper deals with the development of methodology suited for design of computation algorithm which is able to determine power losses of electronic systems based on measured temperature distribution. Second part of paper is given to development of methodology for optimal selection of mentioned active components for thermal simulation model of given electronic system. Finally experimental verification of proposed methodology is presented.

Keywords

electronics packaging; heat transfer; losses; temperature distribution; temperature measurement; thermal analysis; active components; computation algorithm design; electronic system; heat transfer; indirect investigation; methodology development; optimal selection; packaging process; power losses; temperature distribution measurement; thermal simulation model; Computational modeling; Heating; Integrated circuit modeling; Loss measurement; Mathematical model; Power dissipation; Temperature measurement; deterministic algorithm; optimization; thermal model;

fLanguage

English

Publisher

ieee

Conference_Titel

Applied Electronics (AE), 2014 International Conference on

Conference_Location

Pilsen

ISSN

1803-7232

Print_ISBN

978-8-0261-0276-2

Type

conf

DOI

10.1109/AE.2014.7011676

Filename

7011676