DocumentCode
2264929
Title
Inspection recipe management based on captured defect distribution
Author
Ono, M. ; Asakawa, Yuki ; Sato, Takao
Author_Institution
Manuf. Syst. 2nd Dept., Hitachi Ltd., Yokohama, Japan
fYear
2003
fDate
30 Sept.-2 Oct. 2003
Firstpage
145
Lastpage
148
Abstract
In-line defect inspection tools need a recipe for defect detection at each inspection step. Conventional recipe criteria do not adequately determine the quality of the recipe, so a new recipe evaluation measure called OAR (Overlooked Area Ratio) was developed to quantify the defect distribution of the inspection results. The OAR method was applied to actual inspection data, and the results verified the validity of the method.
Keywords
flaw detection; inspection; semiconductor device manufacture; system-on-chip; captured defect distribution; defect detection; inspection recipe management; line defect inspection tools; overlooked area ratio; recipe evaluation; Area measurement; Circuits; Data analysis; Inspection; Manufacturing processes; Manufacturing systems; Performance analysis; Semiconductor device measurement; System-on-a-chip; Yield estimation;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2003 IEEE International Symposium on
ISSN
1523-553X
Print_ISBN
0-7803-7894-6
Type
conf
DOI
10.1109/ISSM.2003.1243251
Filename
1243251
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