Title :
Fault isolation and performance characterization of high speed digital multichip modules
Author_Institution :
Center for Microelectron. Res., Univ. of South Florida, Tampa, FL, USA
fDate :
31 Jan-2 Feb 1995
Abstract :
This paper describes two methods for testing high performance digital multichip modules (MCMs). The first technique provides a method for multiplexing automatic test system channels so that clock and data rates can be extended beyond the normal frequency limits of the Automatic Test Equipment (ATE). The multiplexing method has been successfully applied at rates up to 1.6 GHz using 200 MHz ATE. The second approach utilizes an electron beam probe system operating in the voltage contrast mode to measure electrical signals within the MCM. The e-beam probe can be used to supplement scan-based techniques for isolating faults. It can also be used for characterizing signal quality (rise-time, overshoot, crosstalk, reflections) and measurement of relative delays in high performance MCMs
Keywords :
UHF measurement; automatic test equipment; automatic testing; crosstalk; delays; digital integrated circuits; electron beam testing; fault location; integrated circuit testing; multichip modules; multiplexing; 1.6 GHz; 200 MHz; ATE channels multiplexing; MCM testing; automatic test system channels; clock rates; crosstalk; data rates; e-beam probe; electron beam probe system; fault isolation; high speed digital MCM; multichip modules; overshoot; performance characterization; reflections; relative delays; rise-time; scan-based techniques; signal quality; voltage contrast mode; Automatic test equipment; Automatic testing; Clocks; Electron beams; Frequency; Multichip modules; Multiplexing equipment; Probes; System testing; Voltage;
Conference_Titel :
Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-6970-5
DOI :
10.1109/MCMC.1995.511999