DocumentCode
2266895
Title
On handling fixed blocks in incremental fixed-outline floorplanning
Author
He, Zhigang ; Ma, Yuchun ; Xu, Ning ; Wang, Yu ; Hong, Xianlong
Author_Institution
Sch. of Comput. Sci. & Technol., WuHan Univ. of Technol., Wuhan, China
fYear
2010
fDate
28-30 July 2010
Firstpage
876
Lastpage
880
Abstract
Unlike classical floorplanning that usually only handles block packing to minimize silicon area, modern VLSI floorplanning typically needs to pack blocks within a fixed die(outline) with various user defined constraints. Many algorithms of floorplanning now are with fixed-outline constraint, and these algorithms handle this constraint in the process of stochastic iterative optimization. But the process not only costs too much run time but also is really hard to converge when additional constrains are included. To meet the incremental design requirements, an algorithm to handle fixed-blocks constraints based on given fixed-outline packing with post process is proposed in this paper. By adjusting critical path iteratively in graph of TCG, the violated fixed-outline constraints can be fixed. At the same time, virtual nodes are added into TCG for the constrained blocks with fixed positions so that both fixed-outline constraints and fixed-blocks constraints can be satisfied during the incremental process. Experimental results on MCNC benchmarks show that our algorithm can fix all the violations effectively that for ami49 with 49 blocks, it only takes less than 0.3s to handle the fixed-outline constraints. The degradation on area and wirelength are controlled to about 1.3% and 19.5% respectively.
Keywords
VLSI; circuit layout; circuit optimisation; iterative methods; silicon; stochastic processes; VLSI floorplanning; block packing; fixed blocks; fixed die; fixed-outline packing; incremental fixed-outline floorplanning; stochastic iterative optimization; Benchmark testing; Equations;
fLanguage
English
Publisher
ieee
Conference_Titel
Communications, Circuits and Systems (ICCCAS), 2010 International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4244-8224-5
Type
conf
DOI
10.1109/ICCCAS.2010.5581854
Filename
5581854
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