Semiconductor substrates in phased arrays: integration issues, challenges and laboratory results

Author

Rock, Janice C.

Author_Institution

U.S. Army Aviation & Missile Res., Dev., & Eng. Center, AMSAM-RD-MG-RF, Redstone Arsenal, AL

fYear

0

fDate

0-0 0

Abstract

This paper discusses the ongoing research being conducted in the RF Technology Division of the Applied Sensors, Guidance, and Electronics Directorate, US Army Aviation and Missile Research, Development, and Engineering Center (AMRDEC) on the Redstone Arsenal in Huntsville, Alabama. The overall purpose of the research is to determine and overcome the technological barriers impinging upon enhancements to current phased array technology which is expected to include MEMS in addition to chip-level integration of multiple phased array components. An overview of phased array systems and components will be presented along with applications and insertion into potential military systems and the benefits thereof. The paper will discuss the current research effort and future research areas for this project and its benefits in creating an air defense system to support the Future Combat System (FCS) of the US Army

Keywords

antenna phased arrays; defence industry; micromechanical devices; military equipment; military systems; semiconductor materials; substrates; Future Combat System; MEMS; US Army; air defense system; chip-level integration; integration issues; military systems; multiple phased array components; phased array systems; phased array technology; phased arrays; semiconductor substrates; technological barriers; Antenna arrays; Dielectric substrates; Electromagnetic propagation; Electromagnetic radiation; Fabrication; Laboratories; Missiles; Phased arrays; Semiconductor device packaging; Semiconductor materials;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace Conference, 2006 IEEE

Conference_Location

Big Sky, MT

Print_ISBN

0-7803-9545-X

Type

conf

DOI

10.1109/AERO.2006.1655806

Filename

1655806