DocumentCode :
2272185
Title :
Advanced monolithic packaging concepts for high performance circuits and antennas
Author :
Drayton, R.F. ; Henderson, R.M. ; Katehi, L.P.B.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
Volume :
3
fYear :
1996
fDate :
17-21 June 1996
Firstpage :
1615
Abstract :
Unwanted electromagnetic coupling between neighboring elements is a common problem in high frequency planar circuits. This paper reports on the elimination of crosstalk in planar circuits using conformal micromachined packaging. In the 5 to 30 GHz range, a back-to-back right-angle bend in microstrip has cross-coupling as high as -20 dB. The use of monolithic packaging concepts reduces this coupling by as much as 20-30 dB down to the noise level of the measurement system.
Keywords :
antenna accessories; crosstalk; microstrip circuits; microwave antennas; packaging; 5 to 30 GHz; antenna; back-to-back right-angle bend; conformal micromachined packaging; cross-coupling; crosstalk; electromagnetic coupling; high frequency planar circuit; microstrip; monolithic packaging; Coupling circuits; Electromagnetic coupling; Electromagnetic radiation; Frequency; Laboratories; Microstrip; Noise level; Packaging; Silicon; VHF circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location :
San Francisco, CA, USA
ISSN :
0149-645X
Print_ISBN :
0-7803-3246-6
Type :
conf
DOI :
10.1109/MWSYM.1996.512247
Filename :
512247
Link To Document :
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