DocumentCode :
2272229
Title :
High frequency hermetic packages using LTCC
Author :
Tsang-Der Ni ; Demarco, J. ; Sturzebecher, D. ; Cummings, M.
Author_Institution :
US Army Res. Lab., Fort Monmouth, NJ, USA
Volume :
3
fYear :
1996
fDate :
17-21 June 1996
Firstpage :
1627
Abstract :
This paper presents an experimental comparison of stripline versus modified coplanar waveguide transitions for use in high frequency hermetic packages. Low temperature co-fired ceramic is used as the substrate and wall material. It is shown that these hermetic wall transitions have low insertion loss at the designed frequency range from 30 GHz to 40 GHz, thus usable for an assortment of millimeter-wave packaging applications.
Keywords :
ceramics; coplanar waveguides; millimetre wave circuits; packaging; strip lines; 30 to 40 GHz; LTCC; coplanar waveguide transition; high frequency hermetic package; insertion loss; low temperature co-fired ceramic; millimeter-wave package; stripline transition; wall transition; Ceramics; Coplanar waveguides; Electronic packaging thermal management; Electronics packaging; Frequency; Integrated circuit packaging; Microstrip; Millimeter wave technology; Stripline; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location :
San Francisco, CA, USA
ISSN :
0149-645X
Print_ISBN :
0-7803-3246-6
Type :
conf
DOI :
10.1109/MWSYM.1996.512250
Filename :
512250
Link To Document :
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