Effects of IMC thickness on fracturing of solder joints

Author

Wang Chunke ; Qin Fei ; An Tong

Author_Institution

Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China

fYear

2010

fDate

16-19 Aug. 2010

Firstpage

511

Lastpage

514

Abstract

Cracking along the intermetallic compound (IMC) interface in solder joints is the most important failure mechanism in electronics packages. In order to understand the failure mechanism well, a 2D solder/IMC interface model is used to examine the stress around the interface. Three solder materials, Sn37Pb, Sn3.5Ag and Sn3.0Ag0.5Cu, and various IMC thicknesses, which represent different growth stages of the IMC, are considered to investigate their effects on the interfacial stress. The stress intensity factor, H, which is used as bi-material interface failure criterion, are calculated for various IMC thicknesses.

Keywords

copper alloys; cracks; electronics packaging; fracture; lead alloys; silver alloys; solders; tin alloys; 2D solder-IMC interface model; SnAgCu; SnPb; cracking; electronics packages; fracture; interfacial stress; intermetallic compound thickness; solder joints; stress intensity factor; Electronics packaging; Joints; Lead; Materials; Reliability; Soldering; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Conference_Location

Xi´an

Print_ISBN

978-1-4244-8140-8

Type

conf

DOI

10.1109/ICEPT.2010.5582395

Filename

5582395