Manufacturing test technologies for commercial GaAs RF/microwave integrated circuits

Author

Ersland, P. ; Cousineau, S. ; Mahon, J. ; Lanteri, J.-P.

Author_Institution

Microelectron Div., M/A-COM, Lowell, MA, USA

fYear

1995

fDate

20-22 Feb. 1995

Firstpage

99

Lastpage

103

Abstract

The unique requirements of a production test for commercial RF/microwave IC products are described. As product cost is one of the most significant discriminators in this marketplace, techniques for minimizing the impact of test on product cost are discussed, including test system hardware, software, test plans and automated device handling. To further illustrate the impact of these techniques an example of production test for a plastic packaged single pole double throw (SPDT) switch is presented.

Keywords

III-VI semiconductors; MMIC; antenna accessories; automatic test equipment; cellular radio; economics; gallium arsenide; integrated circuit manufacture; integrated circuit testing; land mobile radio; plastic packaging; semiconductor device packaging; semiconductor switches; telecommunication equipment testing; transceivers; GaAs; automated device handling; commercial GaAs RF integrated circuits; commercial GaAs microwave integrated circuit; manufacturing test technologies; minimization; plastic packaged single pole double throw switch; product cost; production test; software; test plans; test system hardware; Automatic testing; Costs; Gallium arsenide; Manufacturing; Microwave technology; Production; Radio frequency; Software testing; Switches; System testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Technologies for Wireless Applications Digest, 1995., MTT-S Symposium on

Conference_Location

Vancouver, BC, Canada

Print_ISBN

0-7803-1982-6

Type

conf

DOI

10.1109/MTTTWA.1995.512333

Filename

512333