Title :
Preparation and characterization of ultrasonic electrodeposited copper coating
Author :
Cui, Ronghong ; He, Yuting ; Yu, Zhiming ; Shu, Wenjun ; Du, Jinqiang
Author_Institution :
Eng. Coll., Air Force Eng. Univ., Xi´´an, China
Abstract :
Copper has replaced aluminum as the main interconnect material in VLSI, due to its low resistivity and high electromigration resistance. The property of copper coating is a key factor that determines the reliability of interconnects. A special copper coating was prepared by ultrasonic-electrodeposition method in this study, and the microstructure, hardness, wear resistance, adhesion and corrosion resistance of it were investigated respectively. Test results show that the crystallite size of it is obviously smaller than that of the ordinary electrodeposited copper coating, and the hardness, wear resistance, adhesion and corrosion resistance of it are all evidently enhanced.
Keywords :
VLSI; copper; electrodeposition; integrated circuit interconnections; integrated circuit reliability; ultrasonic applications; Cu; VLSI interconnect material; adhesion resistance; corrosion resistance; high electromigration resistance; interconnect reliability; ultrasonic electrodeposited copper coating method; wear resistance; Acoustics; Adhesives; Coatings; Copper; Corrosion; Resistance; Surface treatment;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582413
