DocumentCode
2274797
Title
Phosphorous transient enhanced diffusion suppression with cluster carbon co-implantation at low temperature
Author
Nakashima, Yoshiki ; Hamamoto, Nariaki ; Nagayama, Tsutomu ; Koga, Yuji ; Umisedo, Sei ; Hashimoto, Masahiro ; Onoda, Hiroshi
Author_Institution
Nissin Ion Equip. Co., Ltd., Kyoto, Japan
fYear
2012
fDate
14-15 May 2012
Firstpage
109
Lastpage
112
Abstract
Low temperature cluster carbon co-implantation was applied for phosphorous activation enhancement and transient enhanced diffusion (TED) suppression. The dependence of phosphorous activation and TED on 1) carbon energy, 2) dose and 3) substrate temperature have been investigated. 1) Implanted carbon depth compared with phosphorous depth was optimized for better phosphorous TED suppression and phosphorous activation. 2) Junction depth and sheet resistance (Rs) were evaluated as a function of carbon dose. 3) Amorphous layer thickness was controlled by cooling down the substrate temperature and the influence on TED and activation was evaluated. Finally shallow junction with low Rs has been achieved using low temperature cluster carbon co-implantation.
Keywords
diffusion; ion implantation; phosphorus; amorphous layer thickness; carbon dose; carbon energy; implanted carbon depth; junction depth; low temperature cluster carbon co-implantation; phosphorous TED suppression; phosphorous activation enhancement; phosphorous depth; phosphorous transient enhanced diffusion suppression; sheet resistance; substrate temperature; Annealing; Carbon; Junctions; Resistance; Silicon; Substrates; Temperature dependence;
fLanguage
English
Publisher
ieee
Conference_Titel
Junction Technology (IWJT), 2012 12th International Workshop on
Conference_Location
Shanghai
Print_ISBN
978-1-4673-1258-5
Electronic_ISBN
978-1-4673-1256-1
Type
conf
DOI
10.1109/IWJT.2012.6212821
Filename
6212821
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