• DocumentCode
    2274797
  • Title

    Phosphorous transient enhanced diffusion suppression with cluster carbon co-implantation at low temperature

  • Author

    Nakashima, Yoshiki ; Hamamoto, Nariaki ; Nagayama, Tsutomu ; Koga, Yuji ; Umisedo, Sei ; Hashimoto, Masahiro ; Onoda, Hiroshi

  • Author_Institution
    Nissin Ion Equip. Co., Ltd., Kyoto, Japan
  • fYear
    2012
  • fDate
    14-15 May 2012
  • Firstpage
    109
  • Lastpage
    112
  • Abstract
    Low temperature cluster carbon co-implantation was applied for phosphorous activation enhancement and transient enhanced diffusion (TED) suppression. The dependence of phosphorous activation and TED on 1) carbon energy, 2) dose and 3) substrate temperature have been investigated. 1) Implanted carbon depth compared with phosphorous depth was optimized for better phosphorous TED suppression and phosphorous activation. 2) Junction depth and sheet resistance (Rs) were evaluated as a function of carbon dose. 3) Amorphous layer thickness was controlled by cooling down the substrate temperature and the influence on TED and activation was evaluated. Finally shallow junction with low Rs has been achieved using low temperature cluster carbon co-implantation.
  • Keywords
    diffusion; ion implantation; phosphorus; amorphous layer thickness; carbon dose; carbon energy; implanted carbon depth; junction depth; low temperature cluster carbon co-implantation; phosphorous TED suppression; phosphorous activation enhancement; phosphorous depth; phosphorous transient enhanced diffusion suppression; sheet resistance; substrate temperature; Annealing; Carbon; Junctions; Resistance; Silicon; Substrates; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology (IWJT), 2012 12th International Workshop on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4673-1258-5
  • Electronic_ISBN
    978-1-4673-1256-1
  • Type

    conf

  • DOI
    10.1109/IWJT.2012.6212821
  • Filename
    6212821