DocumentCode
2275941
Title
Defect inspection challenges and solutions for ultra-thin SOI
Author
Brun, Roland ; Moulin, Cecile ; Schwarzenbach, Walter ; Bast, Gerhard ; Aristov, Victor ; Belyaev, Alexander
Author_Institution
Defectivity Eng. Group, SOITEC, Bernin, France
fYear
2012
fDate
15-17 May 2012
Firstpage
67
Lastpage
71
Abstract
This paper will explain the challenges and solutions for ultra thin SOI inspection using a laser light scattering based system. The impact of reflectivity on haze, sizing and minimum threshold will be detailed. We will show how the required sensitivity for 28nm (and beyond node) SOI inspection was achieved using a commercially available unpatterned DUV inspection system. We will also study improvements in defect classification.
Keywords
inspection; light scattering; silicon-on-insulator; defect classification; defect inspection; laser light scattering; ultra-thin SOI; unpatterned DUV inspection system; Apertures; Films; Inspection; Reflectivity; Sensitivity; Silicon; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI
Conference_Location
Saratoga Springs, NY
ISSN
1078-8743
Print_ISBN
978-1-4673-0350-7
Type
conf
DOI
10.1109/ASMC.2012.6212870
Filename
6212870
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