Title :
Integrated (Ba,Sr) TiO3 (BST) films on copper and alumina for monolithic microwave integrated circuit (MMIC) applications
Author :
Clem, P.G. ; Sigman, J. ; Nordquist, C.D.
Author_Institution :
Sandia Nat. Lab., Albuquerque
Abstract :
For development of tunable dielectric microwave devices, the ability to integrate ferroelectric and paraelectric films with low loss dielectric substrates, such as alumina, and with high conductivity metal top and bottom electrodes and vias, such as copper, is of interest. Reducing atmosphere processing has been developed to enable tunable dielectric monolithic microwave integrated circuit (MMIC) devices including tunable capacitors, phase shifters, distributed transmission line true time delay (TTD) elements, and combline filters on alumina substrates. Process and integration details of tunable BST circuit fabrication with novel copper-tungsten vias and semiconducting TaN biasing electrodes are presented.
Keywords :
MMIC phase shifters; barium compounds; ferroelectric capacitors; ferroelectric thin films; semiconductor materials; strontium compounds; tantalum compounds; Al2O3; BST circuit fabrication; Cu-BaSrTiO3-Cu-CuW-Al2O3; MMIC; TaN; alumina substrates; atmosphere processing; copper; copper-tungsten vias; distributed transmission line true time delay elements; integrated films; low loss dielectric substrates; monolithic microwave integrated circuit applications; phase shifters; semiconducting biasing electrodes; tunable capacitors; tunable dielectric microwave devices; Conductive films; Dielectric devices; Dielectric losses; Dielectric substrates; Electrodes; Ferroelectric films; Ferroelectric materials; MMICs; Microwave devices; Tunable circuits and devices;
Conference_Titel :
Applications of Ferroelectrics, 2007. ISAF 2007. Sixteenth IEEE International Symposium on
Conference_Location :
Nara
Print_ISBN :
978-1-4244-1334-8
Electronic_ISBN :
1099-4734
DOI :
10.1109/ISAF.2007.4393214
