• DocumentCode
    227703
  • Title

    Sponsors

  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    The conference organizers greatly appreciate the support of the various corporate sponsors listed.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
  • Conference_Location
    Orlando, FL, USA
  • ISSN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2014.6892255
  • Filename
    6892255
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=227703