Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages

Author

Hu, Gojun ; Tay, Andrew A O ; Zhang, Yongwei ; Zhu, Wenhui ; Chew, Spencer

Author_Institution

Cookson Semicond. Packaging Mater., Singapore

fYear

2006

fDate

6-8 Dec. 2006

Firstpage

53

Lastpage

59

Abstract

Over the glass transition temperature, molding compounds strongly exhibit viscoelastic behavior which causes their Young´s moduli to be not only temperature-dependent but also time-dependent. In the present study, the stress relaxation test is used for the characterization of the viscoelasticity of an epoxy molding compound. The viscoelastic properties of the epoxy molding compound are determined in terms of Prony coefficients, relaxation time and time-temperature shift factors. Furthermore, the effect of viscoelasticity on the delamination in IC packaging is investigated

Keywords

Young´s modulus; delamination; failure analysis; glass transition; integrated circuit packaging; polymers; stress relaxation; viscoelasticity; Prony coefficients; Young moduli; delamination analysis; epoxy molding compound; glass transition temperature; integrated circuit packaging; relaxation time; stress relaxation; time-temperature shift factors; viscoelastic behaviour; Application specific integrated circuits; Capacitive sensors; Delamination; Elasticity; Integrated circuit modeling; Integrated circuit packaging; Materials testing; Temperature; Thermal stresses; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2006. EPTC '06. 8th

Conference_Location

Singapore

Print_ISBN

1-4244-0664-1

Electronic_ISBN

1-4244-0665-X

Type

conf

DOI

10.1109/EPTC.2006.342690

Filename

4147219