Title :
Microstructures and characteristics of micro bump connection after ultrasonic flip-chip bonding
Author :
Sugimoto, Tetsuya ; Morizono, Yasuhiro ; Ohno, Yasuhide
Author_Institution :
Graduate Sch. of Sci. & Technol., Kumamoto Univ.
Abstract :
The effectiveness of ultrasonic bonding on the formation of micro bump connection has been investigated on the basis of microstructural observations and bonding characteristics. 216 gold bumps were formed on a silicon substrate by photolithography and plating techniques. Two silicon substrates with such bumps were positioned, and then jointed using commercial bonding machine equipped with ultrasonic transducer. It was found that the sound bond could be achieved between the micro bumps of 25muim times 25mum in size by the control of applied load during the bonding.
Keywords :
electronics packaging; flip-chip devices; photolithography; ultrasonic bonding; ultrasonic transducers; 25 micron; commercial bonding machine; flip-chip bonding; micro bump connection; photolithography; ultrasonic bonding; ultrasonic transducer; Bonding; Electronics packaging; Gold; Lithography; Materials science and technology; Microstructure; Packaging machines; Semiconductor device packaging; Silicon; Substrates;
Conference_Titel :
Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
Conference_Location :
Singapore
Print_ISBN :
1-4244-0664-1
Electronic_ISBN :
1-4244-0665-X
DOI :
10.1109/EPTC.2006.342713
