DocumentCode
227830
Title
Investigation of flow boiling characteristics in expanding silicon microgap heat sink
Author
Tamanna, Alam ; Poh Seng Lee
Author_Institution
Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore, Singapore
fYear
2014
fDate
27-30 May 2014
Firstpage
458
Lastpage
465
Abstract
Flow boiling microgap heat sink is attractive due to its high heat transfer capability in compact spaces with a smaller rate of coolant flow than its single phase counterpart. Other advantages of this method are the ease of fabrication and implementation (direct cooling). Although there is general agreement that this system may be able to maintain greater temperature uniformity across the heat sink and reduce flow boiling instabilities, their heat transfer and instability characteristics along with flow visualization in expanding microgap heat sink are unavailable in literature till date and require investigation.
Keywords
boiling; confined flow; coolants; flow instability; flow visualisation; heat sinks; heat transfer; microfluidics; two-phase flow; coolant flow rate; deionized water mass flux; depth 200 mum; depth 300 mum; flow boiling characteristics; flow boiling instability reduction; flow reversal; flow visualization; heat transfer; heat transfer capability; microgap configuration; pressure drop; temperature uniformity; two phase expanding microgap heat sink; Heat sinks; Heat transfer; Silicon; Substrates; Temperature measurement; Water heating; Expanding Microgap; Flow Boiling; Heat Transfer; Instability; Pressure Drop;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location
Orlando, FL
ISSN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2014.6892317
Filename
6892317
Link To Document