• DocumentCode
    2279392
  • Title

    Evaluation of high frequency characteristics of ALIVH substrate for 60 GHz RF modules

  • Author

    Nakase, Hiroyuki ; Fujii, Takashi ; Oshima, Shoichi ; Oguma, Hiroshi ; Kameda, Suguru ; Isota, Yoji ; Tsubouchi, Kazuo

  • Author_Institution
    Res. Inst. of Electr. Commun., Tohoku Univ., Aoba
  • fYear
    2006
  • fDate
    6-8 Dec. 2006
  • Firstpage
    639
  • Lastpage
    642
  • Abstract
    High frequency characteristics of any layer interstitial via hole (ALIVH) substrate have been evaluated for an application to the RF modules on 60GHz. A dielectric constant and loss tangent up to 60GHz was measured using strip line resonator designed on the ALIVH substrate. Measured dielectric constant 3.85-3.47 and loss tangent of 0.032-0.043 were almost constant from 2.5GHz to 60GHz. Equivalent lumped component circuit of via hole was modeled from measurement of frequency of strip line resonator with via hole. T-type LC circuit was employed for the circuit. The evaluated inductance was 0.090-0.128 nH and capacitance was 0.129-0.195 pF. It was confirmed that the high frequency characteristics of ALIVH were sufficient for the application to RF module and 3D SiP with no critical degradation.
  • Keywords
    integrated circuit packaging; modules; radiofrequency integrated circuits; silicon compounds; 60 GHz; ALIVH substrate; RF modules; SiP; high frequency characteristics; Circuits; Dielectric constant; Dielectric loss measurement; Dielectric measurements; Dielectric substrates; Frequency measurement; Inductance; Loss measurement; Radio frequency; Strips;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
  • Conference_Location
    Singapore
  • Print_ISBN
    1-4244-0664-1
  • Electronic_ISBN
    1-4244-0665-X
  • Type

    conf

  • DOI
    10.1109/EPTC.2006.342788
  • Filename
    4147317