Novel solder-on-pad (SoP) technology for fine-pitch flip chip bonding

Author

Choi, Kwang-Seong ; Choo, Sun-Woo ; Lee, Jong-Jin ; Sung, Ki-Jun ; Bae, Hyun-Chel ; Lim, Byeong-Ok ; Moon, Jong-Tae ; Eom, Yong-Sung

Author_Institution

Electron. & Telecommun. Res. Inst., Daejeon, South Korea

fYear

2010

fDate

16-19 Aug. 2010

Firstpage

805

Lastpage

809

Abstract

Solder-on-pad (SoP) technology gives the fine-pitch flip chip bonding manufacturability and reliability. For the SoP technology with pitch equal to or less than 150 μm pitch, there are many candidates. The cost-effectiveness will be one of the major criteria determining the industry preference. A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology (SoP) of the fine pitch flip chip bonding. With this material, the solder bump array was successfully formed with pitch of 150 μm in one direction.

Keywords

bonding processes; copper alloys; flip-chip devices; silver alloys; solders; tin alloys; SnAgCu; bumping material; fine-pitch flip chip bonding manufacturability; fine-pitch flip chip bonding reliability; maskless solder-on-pad technology; resin; solder bump array; Flip chip; Heating; Packaging; Powders; Resins; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Conference_Location

Xi´an

Print_ISBN

978-1-4244-8140-8

Type

conf

DOI

10.1109/ICEPT.2010.5582689

Filename

5582689