DocumentCode
2279628
Title
Tin whisker mitigation study on alloy 42 pure tin plating
Author
Sriyarunya, Anocha ; Tondtan, J.
Author_Institution
Spansion (Thailand) Ltd.
fYear
2006
fDate
6-8 Dec. 2006
Firstpage
726
Lastpage
732
Abstract
Tin plating on components finishes may grow whisker under certain condition. A42 (FeNi42) leadframe is well known on tin whisker growth after thermal cycling which caused by the thermal mismatch of tin and FeNi42. In this paper we study on finding the tin whisker mitigation to control the tin whisker growth within the whisker length specification limit (<50 mum) by studied on various leadframe pretreatment(descale) concentration, various pure tin plating chemistry and study on whisker mitigation technique on annealing (150C,1 hr) and SMT reflow
Keywords
annealing; iron alloys; nickel alloys; surface mount technology; whiskers (crystal); 1 hr; 150 C; FeNi; SMT reflow; alloy 42; annealing; pure tin plating; thermal cycling; thermal mismatch; tin whisker growth; tin whisker mitigation; Annealing; Inspection; Isothermal processes; Lead; Morphology; Packaging; Surface-mount technology; Temperature control; Testing; Tin alloys;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
Conference_Location
Singapore
Print_ISBN
1-4244-0664-1
Electronic_ISBN
1-4244-0665-X
Type
conf
DOI
10.1109/EPTC.2006.342803
Filename
4147332
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