• DocumentCode
    2279633
  • Title

    Planar inductors for high frequency DC-DC converters using microwave magnetic material

  • Author

    Martin, Christian ; Allard, Bruno ; Tournier, Dominique ; Soueidan, Maher ; Rousseau, Jean-Jacques ; Allessem, Désiré ; Ménager, Ludovic ; Bley, Vincent ; Lembeye, Jean-Yves

  • Author_Institution
    Ampere-Lab., Univ. de Lyon, Lyon, France
  • fYear
    2009
  • fDate
    20-24 Sept. 2009
  • Firstpage
    1890
  • Lastpage
    1894
  • Abstract
    Paper presents simulation and primary experimental results about the fabrication of planar inductances for monolithic DC/DC converters in System-In-Package environment. A microwave magnetic material (YIG) and electroplated copper winding are proposed. A low-cost manufacturing process is proposed that uses dry film instead of UV SU8 resin. Literature details similar manufacturing processes but the proposed magnetic material enables to operate in the 100 MHz range. Simulation results based on HFSS and Flux2D simulators present the sensitivity of the inductor to geometrical parameters. Samples have been fabricated for a 1 W, Vin = 3.6 V, Vout = 1 V converter and a switching frequency above 100 MHz. An optimized 25 nH inductor with expected 50 m Omega RDC, 3 mm2 has been designed. Primary results indicate that the nH/(m Omega.mm2) metric is promising and truly comparable to already published results.
  • Keywords
    DC-DC power convertors; finite element analysis; magnetic cores; microwave materials; system-in-package; wafer-scale integration; electroplated copper winding; high frequency DC-DC converters; hybrid integrated circuit fabrication; magnetic cores; microwave magnetic material; monolithic DC/DC converters; planar inductors; system-in-package environment; voltage 3.6 V; wafer-scale integration; DC-DC power conversion; Hybrid integrated circuit fabrication; Inductance; Magnetic cores; Wafer-scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2893-9
  • Electronic_ISBN
    978-1-4244-2893-9
  • Type

    conf

  • DOI
    10.1109/ECCE.2009.5316363
  • Filename
    5316363