DocumentCode
2279633
Title
Planar inductors for high frequency DC-DC converters using microwave magnetic material
Author
Martin, Christian ; Allard, Bruno ; Tournier, Dominique ; Soueidan, Maher ; Rousseau, Jean-Jacques ; Allessem, Désiré ; Ménager, Ludovic ; Bley, Vincent ; Lembeye, Jean-Yves
Author_Institution
Ampere-Lab., Univ. de Lyon, Lyon, France
fYear
2009
fDate
20-24 Sept. 2009
Firstpage
1890
Lastpage
1894
Abstract
Paper presents simulation and primary experimental results about the fabrication of planar inductances for monolithic DC/DC converters in System-In-Package environment. A microwave magnetic material (YIG) and electroplated copper winding are proposed. A low-cost manufacturing process is proposed that uses dry film instead of UV SU8 resin. Literature details similar manufacturing processes but the proposed magnetic material enables to operate in the 100 MHz range. Simulation results based on HFSS and Flux2D simulators present the sensitivity of the inductor to geometrical parameters. Samples have been fabricated for a 1 W, Vin = 3.6 V, Vout = 1 V converter and a switching frequency above 100 MHz. An optimized 25 nH inductor with expected 50 m Omega RDC, 3 mm2 has been designed. Primary results indicate that the nH/(m Omega.mm2) metric is promising and truly comparable to already published results.
Keywords
DC-DC power convertors; finite element analysis; magnetic cores; microwave materials; system-in-package; wafer-scale integration; electroplated copper winding; high frequency DC-DC converters; hybrid integrated circuit fabrication; magnetic cores; microwave magnetic material; monolithic DC/DC converters; planar inductors; system-in-package environment; voltage 3.6 V; wafer-scale integration; DC-DC power conversion; Hybrid integrated circuit fabrication; Inductance; Magnetic cores; Wafer-scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2893-9
Electronic_ISBN
978-1-4244-2893-9
Type
conf
DOI
10.1109/ECCE.2009.5316363
Filename
5316363
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