Microelectronics failure analysis using laser ablation of composite materials in system in package

Fast and accurate decapsulation of integrated circuits packages is a key step of successful further observations and defect localization in microelectronics analysis laboratories. In addition to classical techniques, laser technology was introduced to enhance considerably performance in creating precise and local exposure of selective sub layers in complex system in package (SiP). In this paper, we will demonstrate all the benefits of this technique. The results of this new process were characterized according to laser parameters.