DocumentCode
2279771
Title
Assessment of uni-axial mechanical stress on Trench IGBT under severe operating conditions: a 2D physically-based simulation approach
Author
Belmehdi, Y. ; Azzopardi, S. ; Deletage, J.-Y. ; Woirgard, E.
Author_Institution
IMS Lab., Univ. of Bordeaux, Talence, France
fYear
2009
fDate
20-24 Sept. 2009
Firstpage
3942
Lastpage
3947
Abstract
Power devices in their environmental application are submitted in addition to the electrical, thermal, radiation and other kinds of stresses to mechanical stress. In our study, we focus in combination of electrical, thermal and mechanical stresses of a Trench Gate punch through insulated gate bipolar transistor during switching transients. With a 2D physically-based finite elements simulator, we can achieve electro-thermo-mechanical simulations. Two operating configurations have been analyzed: inductive switching and short circuit. Simulation results show that whereas the mechanical stress has low effect on the current tail during clamped inductive switching turn off and on the sustain voltage during unclamped inductive switching, the saturation current during short-circuit operating is strongly affected by external mechanical stress depending on its level, direction and nature (compressive or tensile).
Keywords
finite element analysis; insulated gate bipolar transistors; internal stresses; power semiconductor devices; semiconductor device models; Trench IGBT; Trench gate punch through insulated gate bipolar transistor; clamped inductive switching; electro-thermo-mechanical simulation; finite elements simulation; power devices; saturation current; switching transients; uni-axial mechanical stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2893-9
Electronic_ISBN
978-1-4244-2893-9
Type
conf
DOI
10.1109/ECCE.2009.5316371
Filename
5316371
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