• DocumentCode
    2279771
  • Title

    Assessment of uni-axial mechanical stress on Trench IGBT under severe operating conditions: a 2D physically-based simulation approach

  • Author

    Belmehdi, Y. ; Azzopardi, S. ; Deletage, J.-Y. ; Woirgard, E.

  • Author_Institution
    IMS Lab., Univ. of Bordeaux, Talence, France
  • fYear
    2009
  • fDate
    20-24 Sept. 2009
  • Firstpage
    3942
  • Lastpage
    3947
  • Abstract
    Power devices in their environmental application are submitted in addition to the electrical, thermal, radiation and other kinds of stresses to mechanical stress. In our study, we focus in combination of electrical, thermal and mechanical stresses of a Trench Gate punch through insulated gate bipolar transistor during switching transients. With a 2D physically-based finite elements simulator, we can achieve electro-thermo-mechanical simulations. Two operating configurations have been analyzed: inductive switching and short circuit. Simulation results show that whereas the mechanical stress has low effect on the current tail during clamped inductive switching turn off and on the sustain voltage during unclamped inductive switching, the saturation current during short-circuit operating is strongly affected by external mechanical stress depending on its level, direction and nature (compressive or tensile).
  • Keywords
    finite element analysis; insulated gate bipolar transistors; internal stresses; power semiconductor devices; semiconductor device models; Trench IGBT; Trench gate punch through insulated gate bipolar transistor; clamped inductive switching; electro-thermo-mechanical simulation; finite elements simulation; power devices; saturation current; switching transients; uni-axial mechanical stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2893-9
  • Electronic_ISBN
    978-1-4244-2893-9
  • Type

    conf

  • DOI
    10.1109/ECCE.2009.5316371
  • Filename
    5316371