Towards development of a passive datacenter cooling technology: On-server thermosyphon cooling loop under dynamic workload

Despite many advances in electronics liquid cooling, air still remains one of the main means of cooling of high heat flux servers of datacenters. Regardless their long history of use, air-cooled blade servers continue to introduce strong nuisances that need to be considered during their implementation and operation, for instance: large energy consumption, difficult to manage the flow of air mastered by fans, and thus non-optimal spatial layout of components within a blade, high cost of air flow equipment, acoustical noise limitations, dust, etc. To overcome such problems, a new essential datacenter infrastructure is required.