Title :
Pad finish related board-level solder joint reliability research
Author :
Zhengrong, Chen ; Jianwei, Zhou ; Xingming, Fu ; Jaisung, Lee
Author_Institution :
Samsung Semicond. China R&D CO., Ltd., Suzhou, China
Abstract :
Pad finish is the direct interface between PCB and solder ball, it plays an important role in determining the compound and characteristics of IMC formed at those interfaces, and even to change the mechanical property and microstructure of bulk solder joint. In this paper, we investigated the reliability property of 10 different pad finish combinations. The substrate finish includes electro-plated NiAu, ENEPIG with different Gold and Palladium thickness, and OSP. Board side finishes are ENIG and OSP. We have set up the database of life data for all groups under different reliability test conditions and found out the pad finish related failure mechanism.
Keywords :
failure analysis; integrated circuit metallisation; integrated circuit reliability; printed circuits; solders; surface finishing; ENEPIG; ENIG; IMC; OSP; PCB; board side finishes; board-level solder joint reliability research; bulk solder joint; direct interface; mechanical property; microstructure; pad finish combinations; pad finish related failure mechanism; reliability property; reliability test conditions; solder ball; substrate finish; Fatigue; Gold; Palladium; Reliability; Soldering; Substrates;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582714
