DocumentCode :
228018
Title :
An exergy-based analysis of the effects of rear door heat exchange systems on data center energy efficiency
Author :
Wemhoff, Aaron P. ; Ortega, Antonio
Author_Institution :
NSF Center on Energy-Smart Electron. Syst. (ES2), Villanova Univ., Villanova, PA, USA
fYear :
2014
fDate :
27-30 May 2014
Firstpage :
1129
Lastpage :
1136
Abstract :
A holistic system-level analysis of the energy and mass transfer in a data center cooling system is used to determine the exergy destruction by each component in the system. The analysis, performed using our in-house analysis code, allows for identification of system inefficiencies and comparison of the energy efficiency of different data center cooling strategies. In this paper, we describe a systematic analysis of the exergy destruction in a traditional air-cooled strategy and a hybrid liquid-air system containing rear door heat exchangers (RDHXs). The results show that the exergy destruction by RDHXs increases with the amount of rack heat removal. However, the removal of rack heat concurrently decreases the heat removal and exergy destruction by computer room air handling (CRAH) units. The resultant overall exergy destruction is increased when both RDHX and CRAH units are in operation, but this gain in exergy may be attributed to low heat exchanger effectiveness values. The analysis also shows that when all heat is removed by the RDHX, the exergy destruction is lower than when all heat is removed by the CRAH, suggesting that the data center energy efficiency can be increased through the use of localized hybrid liquid-air cooling schemes as compared to centralized air cooled strategies.
Keywords :
computer centres; cooling; energy conservation; exergy; heat exchangers; mass transfer; CRAH units; RDHX; computer room air handling units; data center cooling system; data center energy efficiency; energy transfer; exergy destruction; exergy-based analysis; holistic system-level analysis; hybrid liquid-air system; in-house analysis code; mass transfer; rack heat removal; rear door heat exchange systems; systematic analysis; Cooling; Equations; Heat transfer; Mathematical model; Servers; Water heating; Data Center; Exergy Destruction; Rear Door Heat Exchanger; Thermal Management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL
ISSN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2014.6892407
Filename :
6892407
Link To Document :
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