Effect of solder joint size on fatigue life of WL-CSP under accelerated thermal cycling using FEM

Author

Bajad, Nupur ; Kulkarni, H. ; Dhole, Satish ; Thakur, Siddharth ; Tonapi, Sandeep

Author_Institution

Anveshak Technol. & Knowledge Solutions, Pune, India

fYear

2014

fDate

27-30 May 2014

Firstpage

1145

Lastpage

1153

Abstract

The effect of solder joint size on wafer level chip scale package reliability has been studied through simulation. A two dimensional finite element model with different solder diameter (250μm, 300μm, 350μm) was studied under accelerated thermal cycling. The failure of the solder joints under thermal fatigue loading is influenced by the solder joint size. Finite element modelling can be used to study the design space and predict failure. In this paper, successive initiation method with energy partitioning approach is used for crack initiation and propagation in the solder joint. The number of thermal cycles to failure are calculated and compared for 250μm, 300μm, 350μm solder diameter.

Keywords

chip scale packaging; failure analysis; finite element analysis; reliability; solders; thermal stress cracking; wafer level packaging; FEM; WL-CSP; accelerated thermal cycling; crack initiation; design space; energy partitioning approach; failure prediction; fatigue life; size 250 mum; size 300 mum; size 350 mum; solder joint failure; solder joint size effect; successive initiation method; thermal fatigue loading; two dimensional finite element model; wafer level chip scale package reliability; Creep; Fatigue; Finite element analysis; Load modeling; Mathematical model; Plastics; Soldering; Solder ball diameter; Successive Initiation method; Thermo-mechanical reliability; Wafer level chip scale package;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on

Conference_Location

Orlando, FL

ISSN

1087-9870

Type

conf

DOI

10.1109/ITHERM.2014.6892409

Filename

6892409