Cross plane thermal conductance of graphene-metal interfaces

Author

Vasquez Guzman, Pablo A. ; Sood, Aditya ; Mleczko, Michal J. ; Wang, Bingdong ; Wong, H.-S Philip ; Nishi, Yoshio ; Asheghi, Mehdi ; Goodson, Kenneth E.

Author_Institution

Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA

fYear

2014

fDate

27-30 May 2014

Firstpage

1385

Lastpage

1389

Abstract

We present an experimental study of cross-plane thermal conductance in metal-graphene-oxide stacks employing time-domain thermoreflectance (TDTR) measurements on Al/m/graphene/SiO₂ structures with monolayer graphene for varying adhesion metals m. Thermal conductance G in the range of 15-60 MWm^-2K^-1 are found across several metals - a two-to-fourfold decrease over Al/m/SiO₂ reference values, charted against metal Debye temperature over a 274-630 K range, as well as electronic work function. The results of this study help with a better understanding of the roles of electron and phonon transport in thermal conduction across graphene-metal interfaces, revealing potential trade-offs between electrical contact resistance and heat management in graphene devices.

Keywords

Debye temperature; aluminium; contact resistance; graphene; heat conduction; silicon compounds; surface conductivity; thermoreflectance; work function; Al-SiO₂; C; Debye temperature; TDTR; cross-plane thermal conductance; electrical contact resistance; electronic work function; graphene-metal interfaces; heat management; metal-graphene-oxide stacks; monolayer graphene; temperature 274 K to 630 K; time-domain thermoreflectance measurements; Adhesives; Films; Graphene; Metals; Temperature measurement; Thermal conductivity; Thermal resistance; Debye temperature; Graphene; metal work function; thermal conductance; time-domain thermoreflectance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on

Conference_Location

Orlando, FL

ISSN

1087-9870

Type

conf

DOI

10.1109/ITHERM.2014.6892441

Filename

6892441