• DocumentCode
    2282005
  • Title

    Efficient thermal simulation for run-time temperature tracking and management

  • Author

    Li, Hang ; Liu, Pu ; Qi, Zhenyu ; Jin, Lingling ; Wu, Wei ; Tan, Sheldon X -D ; Yang, Jun

  • Author_Institution
    Micron Technol. Inc., San Jose, CA, USA
  • fYear
    2005
  • fDate
    2-5 Oct. 2005
  • Firstpage
    130
  • Lastpage
    133
  • Abstract
    As power density increases exponentially, run-time regulation of operating temperature by dynamic thermal management becomes imperative. This paper proposes a novel approach to real-time thermal estimation at chip level for efficient dynamic thermal management in lieu of the thermal sensors, which are erroneous and having longer delays. Our new approach is based on the observation that the average power consumption of architecture level modules in microprocessors running typical workloads determines the trend of temperature variations. Such a feature can be exploited by applying fast moment matching technique in frequency domain. To obtain the transient temperature changes due to initial condition and constant power input pattern, numerically stable moment matching approach is carried out to speed up on-line temperature tracking with high accuracy and low overhead. The resulting fast thermal analysis algorithm has linear time complexity in run-time setting and leads to about two orders of magnitude speed-up over traditional integration-based transient analysis. The average maximum error under running typical benchmarks is only about 0.37°C as compared to other well-accepted simulation tools.
  • Keywords
    frequency-domain analysis; integrated circuit design; logic design; microprocessor chips; thermal analysis; thermal management (packaging); architecture level modules; dynamic thermal management; fast moment matching technique; fast thermal analysis algorithm; frequency domain analysis; integration-based transient analysis; linear time complexity; microprocessors; online temperature tracking; power consumption; power density; real-time thermal estimation; run-time temperature tracking; thermal sensors; thermal simulation; transient temperature changes; Delay estimation; Energy consumption; Energy management; Frequency domain analysis; Microprocessors; Pattern matching; Runtime; Temperature sensors; Thermal management; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design: VLSI in Computers and Processors, 2005. ICCD 2005. Proceedings. 2005 IEEE International Conference on
  • Print_ISBN
    0-7695-2451-6
  • Type

    conf

  • DOI
    10.1109/ICCD.2005.46
  • Filename
    1524142