• DocumentCode
    2283534
  • Title

    Temperature-aware voltage islands architecting in system-on-chip design

  • Author

    Hung, W.L. ; Link, G.M. ; Xie, Yuan ; Vijaykrishnan, N. ; Dhanwada, N. ; Conner, J.

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., USA
  • fYear
    2005
  • fDate
    2-5 Oct. 2005
  • Firstpage
    689
  • Lastpage
    694
  • Abstract
    As technology scales, power consumption and thermal effects have become challenges for system-on-chip designers. The rising on-chip temperatures can have negative impacts on SoC performance, power, and reliability. In view of this, we present a hybrid optimization approach which aims at temperature reduction and hot spot elimination. We demonstrate that considerable improvement in the thermal distribution of a design can be achieved through careful voltage island partitioning, voltage level assignment, and voltage island floorplanning. The experimental results on MCNC benchmarks show significant improvement on the thermal profiles. To the best of our knowledge, this is the first work to explore the thermal impacts of voltage islands.
  • Keywords
    integrated circuit layout; system-on-chip; hot spot elimination; power consumption; system-on-chip design; temperature reduction; thermal distribution; thermal effects; thermal profiles; voltage island floorplanning; voltage island partitioning; voltage level assignment; Costs; Electronic design automation and methodology; Energy consumption; Laboratories; Power system reliability; System-on-a-chip; Temperature; Timing; Voltage; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design: VLSI in Computers and Processors, 2005. ICCD 2005. Proceedings. 2005 IEEE International Conference on
  • Print_ISBN
    0-7695-2451-6
  • Type

    conf

  • DOI
    10.1109/ICCD.2005.103
  • Filename
    1524227