DocumentCode
2283534
Title
Temperature-aware voltage islands architecting in system-on-chip design
Author
Hung, W.L. ; Link, G.M. ; Xie, Yuan ; Vijaykrishnan, N. ; Dhanwada, N. ; Conner, J.
Author_Institution
Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., USA
fYear
2005
fDate
2-5 Oct. 2005
Firstpage
689
Lastpage
694
Abstract
As technology scales, power consumption and thermal effects have become challenges for system-on-chip designers. The rising on-chip temperatures can have negative impacts on SoC performance, power, and reliability. In view of this, we present a hybrid optimization approach which aims at temperature reduction and hot spot elimination. We demonstrate that considerable improvement in the thermal distribution of a design can be achieved through careful voltage island partitioning, voltage level assignment, and voltage island floorplanning. The experimental results on MCNC benchmarks show significant improvement on the thermal profiles. To the best of our knowledge, this is the first work to explore the thermal impacts of voltage islands.
Keywords
integrated circuit layout; system-on-chip; hot spot elimination; power consumption; system-on-chip design; temperature reduction; thermal distribution; thermal effects; thermal profiles; voltage island floorplanning; voltage island partitioning; voltage level assignment; Costs; Electronic design automation and methodology; Energy consumption; Laboratories; Power system reliability; System-on-a-chip; Temperature; Timing; Voltage; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design: VLSI in Computers and Processors, 2005. ICCD 2005. Proceedings. 2005 IEEE International Conference on
Print_ISBN
0-7695-2451-6
Type
conf
DOI
10.1109/ICCD.2005.103
Filename
1524227
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