DocumentCode :
2283639
Title :
A novel method for low impedance design of power and ground planes
Author :
Ling-Song Zhang ; Xing-Chang Wei ; Meng Ni ; Er-Ping Li
Author_Institution :
Dept. of Inf. Sci. & Electron. Eng., Zhejiang Univ. Hangzhou, Hangzhou, China
fYear :
2011
fDate :
12-14 Dec. 2011
Firstpage :
1
Lastpage :
4
Abstract :
To eliminate the noise propagation between the power and ground planes, we propose a method by applying absorbing materials in the package. In the proposed method, absorbing materials are placed on different locations between power and ground planes to verify and compare their performance of noise reduction. From the simulation results, the absorbing materials placed along the boundary of power and ground planes shows a better performance than other layouts at the low frequency, ranging from 0.1GHz to 3.4 GHz, whereas the absorbing materials placed around the via reveals a wonderful performance at the high frequency, ranging from 6 GHz to 10 GHz.
Keywords :
distribution networks; interference suppression; absorbing materials; frequency 0.1 GHz to 3.4 GHz; frequency 6 GHz to 10 GHz; ground plane; low impedance design; noise propagation elimination; noise reduction; power plane; Impedance; Magnetic losses; Magnetic resonance; Metamaterials; Noise; Periodic structures; Power integrity; absorbing material; power distribution network; signal integrity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE
Conference_Location :
Hanzhou
ISSN :
2151-1225
Print_ISBN :
978-1-4673-2288-1
Electronic_ISBN :
2151-1225
Type :
conf
DOI :
10.1109/EDAPS.2011.6213731
Filename :
6213731
Link To Document :
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