Efficient electromagnetic simulation of angled interconnection pattern by conformal- and HIE-FDTD methods

Due to orthogonal grids in conventional finite-difference time-domain (FDTD) methods, difficulty in modeling a complicated structure results in incomplete discretization of space. Therefore, it is inherently difficult to analyze thin structures such as a printed circuit board (PCB) and curved or angled patterns such as interconnection patterns on the PCB. In this paper, we propose an effective electromagnetic simulation technique which is constructed by combining the conformal FDTD (CFDTD) method and the hybrid implicit-explicit (HIE)-FDTD method. The proposed technique can circumvent the above problems by exploiting advantages of the HIE-FDTD method and the CFDTD method. An example model of the interconnection pattern is analyzed by the proposed and conventional methods, and we estimate the accuracy and CPU time of the proposed one.