DocumentCode
2284587
Title
Broadband filter based on stub-loaded ridge substrate integrated waveguide (SIW) in low temperature cofired ceramic (LTCC)
Author
Wu, Lin-Sheng ; Mao, Junfa ; Yin, Wen-Yan ; Zhou, Xi-Lang
Author_Institution
Key Lab. of Minist. of Educ. for Res. of Design & EMC of High Speed Electron. Syst., Shanghai Jiao Tong Univ., Shanghai, China
fYear
2011
fDate
12-14 Dec. 2011
Firstpage
1
Lastpage
4
Abstract
A new broadband bandpass filter is proposed using stub-loaded ridge substrate integrated waveguide (SIW). The ridge SIWs loaded with and without stubs play the roles of resonators and inductive coupling structures, respectively. Since the cutoff frequency of ridge SIW is designed within the passband, both its propagating and evanescent modes are utilized to provide a strong coupling over the whole passband. The proposed filter has a multilayer configuration and can be fabricated with a standard low temperature cofired ceramic (LTCC) technology. In order to validate our design, a LTCC filter prototype is developed with a central frequency of 19 GHz and a fractional bandwidth of 40%. It has a compact volume of 6.89×2.85×0.79 mm3 and a low measured in-band insertion loss of 1.2 dB. The good performance of our proposed SIW filter has been demonstrated by the reasonable agreement obtained between the simulated and measured S-parameters. Its potential application for system in package is expected.
Keywords
S-parameters; band-pass filters; ceramic packaging; resonator filters; ridge waveguides; substrate integrated waveguides; system-in-package; waveguide filters; LTCC; S-parameters; SIW; broadband bandpass filter; evanescent modes; frequency 19 GHz; inductive coupling structures; loss 1.2 dB; low temperature cofired ceramic; multilayer configuration; resonator filters; size 0.79 mm; size 2.85 mm; size 6.89 mm; stub-loaded ridge substrate integrated waveguide; system-in-package; Band pass filters; Couplings; Cutoff frequency; Electromagnetic waveguides; Passband; Resonator filters; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE
Conference_Location
Hanzhou
ISSN
2151-1225
Print_ISBN
978-1-4673-2288-1
Electronic_ISBN
2151-1225
Type
conf
DOI
10.1109/EDAPS.2011.6213780
Filename
6213780
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