DocumentCode
2285646
Title
Modeling of polymer neck generation and its effects on the etch profile for oxide contact hole etching using Ar, CHF/sub 3/, and CF/sub 4/ gases
Author
Jinsung Park ; Hoong Joo Lee ; Jeong-Taek Kong ; Sang Hoon Lee
Author_Institution
CAE Semicond. R&D Center, Samsung Electron. Co. Ltd., Kyungki-Do, South Korea
fYear
1997
fDate
8-10 Sept. 1997
Firstpage
285
Lastpage
287
Abstract
A simple model, which takes into account simultaneous ion-assisted etching and polymer deposition, is presented. The simulation and experiment of test structures show that polymer neck generation is the result of competition of ion assisted etching and polymer deposition along the the sidewall of the contact hole. As the polymer neck also plays as a self-shadowing mask, it determines the final etch profile of the contact hole.
Keywords
polymer films; semiconductor process modelling; sputter etching; Ar; Ar gas; CF/sub 4/ gas; CHF/sub 3/ gas; contact hole sidewall; etch profile; ion-assisted etching; model; oxide contact hole etching; polymer deposition; polymer neck generation; self-shadowing mask; Argon; Gases; Neck; Plasma applications; Plasma simulation; Polymers; Resists; Shape; Sputter etching; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 1997. SISPAD '97., 1997 International Conference on
Conference_Location
Cambridge, MA, USA
Print_ISBN
0-7803-3775-1
Type
conf
DOI
10.1109/SISPAD.1997.621393
Filename
621393
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